2026-07-15 17:16:07
In the backside thinning process of a wafer, the thin film attached to the front side of the wafer (including the active device and microstructure side) is called a backside thinning tape (BG Tape or thin film in the industry)
Its core function is to protect the integrated circuits and micro bumps on the front side of the wafer from physical scratches, contamination by grinding fluid and silicon powder particles during high mechanical stress grinding processes, while buffering mechanical stress and assisting in controlling the total thickness deviation (TTV) of the wafer.
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